STATUS:                                                          Married 

            RESIDENCE:                                                     South Korea 

            EDUCATION:                                                    BSc Industrial Engineering              

            PREVIOUS EMPLOYER:                                    XXXX UK Ltd 

            POSITION:                                                       Sales Director 

A successful and rewarding career to date in the Semiconductor industry, most recently as a Sales  Director generating new business for CMOS sensor, wafer foundry into various markets including cellular, consumer audio, telecoms, automotives.  

A combination of very strong technical and commercial experience gives a good understanding of how such companies work from the top down and a detailed understanding of the markets addressed.  

Good language speaker both English and Korean. 

Possessing strong communication skills, experience of liaison at all levels coupled with a keen pro-active approach. Ambitious, self-motivated, organised, highly professional, and of a friendly and sociable nature. Also possesses excellent problem-solving and diagnostic attributes and a great deal of sales and marketing and engineering experience as well as more recent directing role for sales organization. 

KEY JOB SKILLS : 

•     Business development for mobile phone companies and major Fabless Semiconductor companies. Target markets included automotive, medical, PC, consumer, industrial, sensors, cellular, telematics,  telecoms, audio. 

•     Customer facing skills at all levels including senior management. Customer requirements assessment- strong commercial focus on design-wins with a detailed technical knowledge of the product. Identification and following up of new business opportunities. Development of relationships with new and existing clients.

•     Understanding of semiconductor industries and the applications for wired and wireless chips and system products therein.  Worked closely with the design teams and third party solutions providers, software stack providers. 

• Knowledge of component technologies and its trend gained through world leading mobile and Fabless semiconductors companies.

•     Worked in US, Germany, UK, as well as Korea. Fluent language speaker. Well rounded worldwide traveller with a high degree of high value sales and client entertainment experience. 

•     Wafer Fab manufacturing experience and knowledge of system requirements gives a well rounded understanding of both technical and commercial requirements. 

•     Conferences and exhibitions to promote the company’s products. 

•     Wide experience of  business travel in worldwide, experience of staff supervision and recruitment.  

•     Worked for many years in assortment of multi-functional organisations, liaising with people at all levels and with different views and directions. Good ‘diplomat’, focused on results and team ethic. 

XXXX UK Ltd  

London, UK July 2003-now. 

Job Title; Managing Director   

•  Focused on customer needs to achieve European Sales using company’s Foundry facilities and customized CMOS Sensor products targeting at key mobile players such as Nokia, Sony-Ericsson, and VitelCom. Resulted in over 30 major new design-wins across Europe totalling $60M revenue with high margin for last 2.5 years. 

•  Defined the strategy to sell its products into the European customer base. Instrumental in defining strategy for EU region.  

•  Visited customers across Europe regularly, presenting and championing the company’s solutions to their senior management up to the point where the design-in was won. 

•  Started to utilize Sales tools such as SAP-CRM to log business opportunities, design-in status and actual design-wins including estimated business value. 

•  Maintained detailed knowledge of various markets in general, and produced a monthly report on the market space with summary comments and updates for management. 

•  Produced competitor analysis to present to management at various levels.   

•  Conferences in the Europe and South Korea, manning the stands, customer facing, press facing and presenting company’s unique solutions. Presented technical papers. 

XXXX Germany 

Frankfurt, Germany Sep 2001-July 2003.  

Job Title; Sales Director   

•     Foundry, ASIC, and MCU Sales within EU Fabless semiconductor companies totalling $70M for two years. 

•     Successfully developed the products for Wolfson, European No. 1 Fabless semiconductor company. 

•     Solution providing with Multi- Process options

•     Successfully develop German Governmenet Toll Collection project with 32bit ARM MCU that provided $20M Revenue for later two years.  

•     Set up an environment in which business could be increased by forming beneficial relations with 3rd parties, by keeping internal staff focused on most likely design-win areas. 

XXXX Korea 

Seoul, South Korea July 1998- Sep 2001 

            Job Title; Senior Sales Manager  

•     In charged of Sales covering US/Japan territory as a senior Foundry sales manager totalling $150M per year. 

•     Controlled over each regional project managers     

•     Dispatched to Silicon Valley in California for regional sales supporting during the period from Feb 1999 to Jan. 2000.  

XXXX Korea 

Ichon, South Korea July1995- July 1998 

Job Title; Semiconductor Technology Planning Manager 

•     Built long-term  technology roadmap for Non-DRAM Products 

•     Alliance plan for NAND Flash technology (ST Microelectronics) 

•     Set-up long-term Logic Process Technology roadmap 

•     Coordinated R&D and Manufacturing  

Seoul, South Korea Dec.1991- July 1995 

Job Title; DRAM Marketing Manager  

•     Played a role as a key DRAM Product Planer 

•     Analyzed macro/micro Market Trend 

•     Regularly attended WSTS(World Semiconductor Trading Statistics) conference as a core member. 

•     Built regular basis mid/long term Marketing strategy  

Ichon, South Korea Jan. 1985- Dec. 1991 

Wafer Fab Manufacturing Engineer 

•     Wafer Fab Engineer for producing 16K/64K SRAM, 1M/4M/16M/64M DRAM, 1K EEPROM using ranging from 5 to 6 inch wafer.(Fab1, 2, 3) 

•     Coordinating all related work-force such as Device Engineering group, Process Engineering group, and Quality&Reliability group. 

•     Participated in Task Force Team for TI IM DRAM Foundry project as a Production Team member, and played a key role to improve yield and productivity at wafer level. 

Place of Birth;

Seoul, South Korea 

High School: 

Dae Shin High School in South Korea, 1975-1978 

University:

Ajou University in South Korea, 1978-1985. BS, Industrial Engineering (including 2.5years military service)  

RECENT TRAINING;

LAMP & Its Couching Program (Large Account Management Program), Miller Heiman, Mar, 2006

LEISURE:

Playing Tennis, Golfing, Swimming, Travelling